NVIDIA plans to raise substrate capacity 2.5x over three years
NVIDIA announced an expansion with six partners that make substrates, test and package AI chips.
NVIDIA is working with companies that make small but essential parts of AI chips. The goal is to make more of them, faster.
Hype check
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Why it matters
Packaging and testing capacity decides how many AI chips reach the market, so more of it eases supply pressure.
Worth a look if you follow supply chains; the effect shows over years.
The details
- Partners: Amkor, IBIDEN, KYEC, Samsung Electro-Mechanics, SPIL and Unimicron.
- NVIDIA is paying KYEC a $1.1 billion capacity reservation advance for new US testing facilities, with high-volume production targeted for April 2027.
- Amkor plans to raise interposer wafer capacity in South Korea by more than 300% by the end of 2028.
- SPIL targets a 15x increase in optical-engine capacity in Taiwan by mid-2027.
- NVIDIA expects total semiconductor testing capacity to double from 2026 to 2027.
Receipts
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